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| HCC/HCF4018B PRESETTABLE DIVIDE-BY-N COUNTER .MEDI .FULLYSTATI .QUI .STANDARDI .I .100%TESTEDFORQUI .5V,10V,AND15VPARAMETRI .MEETSALLREQUI UM SPEED OPERATION - 10MHz (typ.) AT VDD - VSS = 10V C OPERATION ESCENT CURRENT SPECIFIED TO 20V FOR HCC DEVICE ZED SYMMETRICAL OUTPUT CHARACTERISTICS NPUT CURRENT OF 100nA AT 18V AND 25C FOR HCC DEVICE ESCENT CURRENT C RATINGS REMENTS OF JEDEC TENTATIVE STANDARD No 13A, "STANDARD SPECIFICATIONS FOR DESCRIPTION OF "B" SERIES CMOS DEVICES" EY (Plastic Package) F (Ceramic Frit Seal Package) M1 (Micro Package) C1 (Plastic Chip Carrier) ORDER CODES : HCC4018BF HCF4018BM1 HCF4018BEY HCF4018BC1 DESCRIPTION The HCC4018B (extended temperature range) and HCF4018B (intermediate temperature range) are monolithic integrated circuit, available in 16-lead dual in-line plastic or ceramic package and plastic micropackage. The HCC/HCF4018B types consist of 5 JohnsonCounter stages, buffered Q outputs from each stage, and counter preset control gating. CLOCK, RESET, DATA, PRESET ENABLE, and 5 individual JAM inputs are provided. Divide by 10, 8, 6, 4, or 2 counter configurations can be implemented by feeding the Q5, Q4, Q3, Q2, Q1 signals, respectively, back to the DATA input. Divide-by-9, 7, 5, or 3 counter configurations can be implemented by the use of a HCC/HCF4011B gate package to properly gate the feedback connection to the DATA input. Divide-by-functions greater than 10 can be achieved by use of multiple HCC/HCF 4018B units. The counter is advanced one count at the positive clock-signal transition. Schmitt Trigger action on the clock line permits unlimited clock rise and fall times. A high RESET signal clears the counter to an all-zero condition. A high PRESENTENABLE signal allows information on the JAM inputs to preset the counter. Anti-lock gating is provided to assure the proper counting sequence. June 1989 PIN CONNECTIONS 1/12 HCC/HFC4018B FUNCTIONAL DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol V DD * Vi II Pto t Parameter Supply Voltage : HC C Types H CF Types Input Voltage DC Input Current (any one input) Total Power Dissipation (per package) Dissipation per Output Transistor for T o p = Full Package-temperature Range Operating Temperature : HCC Types H CF Types Storage Temperature Value - 0.5 to + 20 - 0.5 to + 18 - 0.5 to V DD + 0.5 10 200 100 - 55 to + 125 - 40 to + 85 - 65 to + 150 Unit V V V mA mW mW C C C T op T stg Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are refered to VSS pin voltage. RECOMMENDED OPERATING CONDITIONS Symbol V DD VI Top Parameter Supply Voltage : HCC Types HC F Types Input Voltage Operating Temperature : HCC Types H CF Types Value 3 to 18 3 to 15 0 to V DD - 55 to + 125 - 40 to + 85 Unit V V V C C 2/12 HCC/HCF4018B LOGIC DIAGRAM TIMING DIAGRAM 3/12 HCC/HFC4018B STATIC ELECTRICAL CHARACTERISTICS (under recommended operating conditions) Test Conditions Symbol Parameter VI (V) 0/ 5 HCC 0/10 Types 0/15 0/20 0/ 5 HCF 0/10 Types 0/15 V OH Output High Voltage 0/ 5 0/10 0/15 V OL Output Low Voltage 5/0 10/0 15/0 V IH Input High Voltage 0.5/4.5 1/9 4.5/0.5 9/1 0/ 5 HCC 0/ 5 Types 0/10 0/15 0/ 5 0/ 5 HCF Types 0/10 0/15 I OL Output Sink Current 0/ 5 HCC 0/10 Types 0/15 0/ 5 HCF 0/10 Types 0/15 I IH , I IL Input Leakage Current HCC 0/18 Types HCF 0/15 Types Any Input 2.5 4.6 9.5 13.5 2.5 4.6 9.5 13.5 0.4 0.5 1.5 0.4 0.5 1.5 <1 <1 <1 <1 <1 <1 <1 <1 <1 <1 VO (V) Value Unit |I O | V D D T L o w* 25 C T Hi g h * (A) (V) Min. Max. Min. Typ. Max. Min. Max. 5 10 15 20 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 5 10 15 5 5 10 15 5 10 15 5 10 15 18 Any Input 15 -2 - 0.64 - 1.6 - 4.2 - 1.53 - 0.52 - 1.3 - 3.6 0.64 1.6 4.2 0.52 1.3 3.6 0.1 0.3 3.5 7 11 1.5 3 4 - 1.6 - 3.2 - 0.51 - 1 - 1.3 - 2.6 - 3.4 - 6.8 - 1.36 - 3.2 - 0.44 - 1 - 1.1 - 2.6 - 3.0 - 6.8 0.51 1.3 3.4 0.44 1.1 3.0 1 2.6 6.8 1 2.6 6.8 10 - 5 0.1 10 - 5 0.3 5 7.5 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 - 1.15 - 0.36 - 0.9 - 2.4 - 1.1 - 0.36 - 0.9 - 2.4 0.36 0.9 2.4 0.36 0.9 2.4 1 1 A mA mA 5 10 20 100 20 40 80 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 V V 0.04 0.04 0.04 0.08 0.04 0.04 0.04 5 10 20 100 20 40 80 4.95 9.95 14.95 0.05 0.05 0.05 V V 150 300 600 3000 150 300 600 A IL Quiescent Current 1.5/13.5 < 1 V IL Input Low Voltage 13.5/1.5 < 1 I OH Output Drive Current CI Input Capacitance pF * TLow = - 55C for HCC device : - 40C for HCF device. * THigh = +125C for HCC device : + 85C for HCF device. The Noise Margin for both "1" and "0" level is : 1V min. with VDD = 5V, 2V min. with VDD = 10V, 2.5 V min. with VDD = 15V. 4/12 HCC/HCF4018B DYNAMIC ELECTRICAL CHARACTERISTICS (T amb = 25C, C L = 50pF, R L = 200k, typical temperature coefficient for all V DD values is 0.3%/C, all input rise and fall times = 20ns) Symbol Parameter Test Conditions V D D (V) Min. 5 10 15 t T HL , t TL H Transition Time 5 10 15 f CL Maximum Clock Input Frequency 5 10 15 tW Clock Input Width 5 10 15 t r, t f Clock Input Rise or Fall Time 5 10 15 tset up Data Input Set-up Time 5 10 15 tH Data Input Hold-time 5 10 15 PRESET* O R RESET OPERATION t PL H, t PHL Propagation Delay Time (reset or reset to Q) 5 10 15 tW Preset or Reset Pulse Width 5 10 15 t re m Preset or Reset Removal Time 5 10 15 160 70 50 80 30 20 275 125 90 80 35 25 40 15 10 ns ns 550 250 180 ns 40 12 6 140 80 60 20 6 3 70 40 30 ns ns Unlimited s 3 7 8.5 160 70 50 Value Typ. 200 90 65 100 50 40 6 14 17 80 35 25 ns MHz Max. 400 180 130 200 100 80 ns ns Unit t PL H, t PHL Propagation Delay Time * At PRESET ENABLE OR JAM inputs 5/12 HCC/HFC4018B Typical Output Low (sink) Current Characteristics. Typical Output high (source) Current Characteristics. Minimum Output High (source) Current Characteristics. typical Output low (sink) Current Characteristics. 6/12 HCC/HCF4018B TYPICAL APPLICATIONS External connections for divide by 10, 9, 8, 7, 6, 5, 4, 3, 2 operation. DIVIDE BY 10 Q5 CONNECTED DIVIDE BY 8 Q4 BACK TO DIVIDE BY 6 Q3 "DATA" DIVIDE BY 4 Q2 NO CONNECTED DIVIDE BY 2 Q1 NO EXTERNAL COMPONENTS REQUIRED 7/12 HCC/HFC4018B Plastic DIP16 (0.25) MECHANICAL DATA mm MIN. a1 B b b1 D E e e3 F I L Z 3.3 1.27 8.5 2.54 17.78 7.1 5.1 0.130 0.050 0.51 0.77 0.5 0.25 20 0.335 0.100 0.700 0.280 0.201 1.65 TYP. MAX. MIN. 0.020 0.030 0.020 0.010 0.787 0.065 inch TYP. MAX. DIM. P001C 8/12 HCC/HCF4018B Ceramic DIP16/1 MECHANICAL DATA mm MIN. A B D E e3 F G H L M N P Q 7.8 2.29 0.4 1.17 0.22 0.51 0.38 17.78 2.79 0.55 1.52 0.31 1.27 10.3 8.05 5.08 0.307 0.090 0.016 0.046 0.009 0.020 3.3 0.015 0.700 0.110 0.022 0.060 0.012 0.050 0.406 0.317 0.200 TYP. MAX. 20 7 0.130 MIN. inch TYP. MAX. 0.787 0.276 DIM. P053D 9/12 HCC/HFC4018B SO16 (Narrow) MECHANICAL DATA DIM. MIN. A a1 a2 b b1 C c1 D E e e3 F G L M S 3.8 4.6 0.5 9.8 5.8 1.27 8.89 4.0 5.3 1.27 0.62 8 (max.) 0.149 0.181 0.019 10 6.2 0.35 0.19 0.5 45 (typ.) 0.385 0.228 0.050 0.350 0.157 0.208 0.050 0.024 0.393 0.244 0.1 mm TYP. MAX. 1.75 0.2 1.65 0.46 0.25 0.013 0.007 0.019 0.004 MIN. inch TYP. MAX. 0.068 0.007 0.064 0.018 0.010 P013H 10/12 HCC/HCF4018B PLCC20 MECHANICAL DATA mm MIN. A B D d1 d2 E e e3 F G M M1 1.27 1.14 7.37 1.27 5.08 0.38 0.101 0.050 0.045 9.78 8.89 4.2 2.54 0.56 8.38 0.290 0.050 0.200 0.015 0.004 TYP. MAX. 10.03 9.04 4.57 MIN. 0.385 0.350 0.165 0.100 0.022 0.330 inch TYP. MAX. 0.395 0.356 0.180 DIM. P027A 11/12 HCC/HFC4018B Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. (c) 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 12/12 |
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